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CommAgility VPX module provides rugged DSP and FPGA performance

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SOURCE CommAgility

TI and Xilinx processors for software radio, imaging or radar applications

LOUGHBOROUGH, England, May 8, 2014 /PRNewswire/ -- CommAgility today announced the VPX-D16A4, a rugged high performance DSP and FPGA based card in the compact VITA™ 65, 3U OpenVPX™ form factor. The module is ideal for applications such as software defined radio (SDR) (including LTE, Remote Radio Head (RRH), WiMax and Cloud RAN), imaging or radar, and is well suited to military or other harsh field deployment environments.

The VPX-D16A4 is CommAgility's first board in the rugged VPX form factor, and is available as either conduction cooled or air cooled versions. For maximum flexibility in interfacing, it supports SRIO, Ethernet, CPRI and Multi-Gigabit Transceiver (MGT) to the backplane plus links to RF or analogue I/O.

The board is based around a Texas Instruments (TI) TCI6638K2K KeyStone™-based System-on-Chip (SoC) and a TI TMS320C6678 SoC, which between them contain sixteen C66x DSP cores and four ARM® Cortex®-A15 cores, as well as baseband and networking accelerators. The two SoCs are closely coupled with TI's HyperLink bus as well as Gigabit Ethernet. Each device has its own large 2Gbytes DDR3 memory bank and a 20Gbaud SRIO link to the VPX backplane.

Edward Young, managing director at CommAgility, said, "Alongside our strong AMC and MicroTCA product portfolio, this move into VPX will help to drive further growth and expand our overall market by taking the same wireless processing technologies into a new rugged form factor."

For additional I/O or co-processing, the main DSP is connected via PCI Express and the AIF2 CPRI interface to a Xilinx Kintex-7 K325T FPGA, which also has Gigabit Ethernet and its own backplane MGT connections. The FPGA has multiple LVDS, GPIO and serial connections to the P2 connector to enable interfacing to an RTM with specialised I/O such as multi-channel RF or high speed ADC/DAC interfaces. It also has a PLL for flexible generation of RF clocks from a standard reference clock input.

The main DSP and FPGA both have a large bank of flash memory for application and data storage, with FLASH upgrades and boot selection managed in conjunction with the Board Management Controller for maximum security.

A full Linux BSP and example software support is provided to accelerate customer development, based on TI's Multicore Software Development Kit (MCSDK) for Linux and the Xilinx Vivado FPGA development suite. MIMOon's mi!SmallCellPHY™-TI is available fully integrated and tested, providing a complete LTE physical layer.

The VPX-D16A4 will be available in Q3 2014. For pricing, please contact CommAgility.

About CommAgility:
CommAgility is an award-winning, world-leading developer of embedded signal processing and radio modules for 4G and 5G mobile network and related applications. We design the latest DSP, FPGA and RF technologies into compact, powerful, and reliable products based on industry standard architectures. Our customers around the world integrate CommAgility products into high performance test equipment, specialised radio and intelligence systems, R&D demonstrators and trial systems. We are highly flexible and work closely with our key customers to meet their technical needs and to support them through development into volume production. CommAgility was honoured with a Queen's Award for Enterprise in International Trade in 2013, and featured in the Deloitte UK Fast 50 list of fastest growing technology companies in 2012 and 2013. See www.commagility.com.

Website: www.commagility.com
Contact: sales@commagility.com
Twitter: @commagility
Tel: +44 1509 228866

About the Texas Instruments Design Network
CommAgility is a member of the TI Design Network, a premier group of independent, well-established companies that offer products and system-level design and manufacturing services complementing TI's semiconductors to a worldwide customer base to accelerate product innovation and time-to-market. Network members provide product design, hardware and software system integration, turnkey product design, RF and processor system modules, reference platforms, software development, proof-of-concept design, feasibility studies, research, certification compliance, prototyping, manufacturing, and product life cycle management. For more information about the TI Design Network, please visit http://www.ti.com/designnetwork.

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